Description
TANK AIoT Dev. Kit
● 6th Gen Intel® Core™ processor platform with Intel® Q170 chipset, chipset and DDR4 memory
● Dual independent display with high resolution support
● Rich high-speed I/O interfaces on one side for easy installation
● On-board internal power connector for providing power to add-on cards
● Great flexibility for hardware expansion
Smart Choice for Inference System With AI
Artificial Intelligence, AI, is changing our lives from the past to the future. It enables machine intelligent by using a variety of training models to simulate and infer the status or appearance of object. For example, the inference system with video analysis model can perform face and car plate analysis for safety and convenience purposes.
TANK AIoT Dev. Kit features rich I/O and dual PCIe by 16 slots with by 8 signal for add-on card installation such as PoE (IPCEI-4POE) card or acceleration card (Mustang-F100-A10 & Mustang-V100-RX8) to enhance function and performance for various applications.
Numerous Face Analysis
Face analysis with AI has explosive growth in various domains. It not only infers features of human like gender, age and facial expression, but also identifies identity, which can greatly reduce labor costs and provide services via big data in retail, finance and medicine.
Numerous Car Plate Analysis
Efficient road tolling and parking reduces fraud related to non-payment, makes charging effective, and reduces required manpower to process. Car plate analysis can be deployed on highways for electronic toll collection, and can be implemented as a method of cataloguing the movements of traffic. In addition, society's security can therefore be enhanced by establishing databases of suspicious cars in a more efficient way.
Machine Vision
Information technology adds intelligence to factories from design to the end of the process. Today’s technologies automate the collection, storage and retrieval of data from across multiple factories and factory sub-systems to make the data available for analysis.
Specification
- Chassis
- Color
- Black C + Silver
- Dimensions (WxDxH)
- 121.5 x 255.2 x 205 mm (4.7" x 10" x 8")
- System Fan
- Fan
- Chassis Construction
- Extruded aluminum alloys
- Weight (Net/Gross)
- 4.2 kg (9.26 lbs)/ 6.3 kg (13.89 lbs)
- Motherboard
- CPU
- Intel® Xeon® E3-1268LV5 2.4GHz (up to 3.4 GHz, Quad Core, TDP 35W)
- Intel® Core™ i7-7700T 2.9GHz (up to 3.8 GHz, Quad Core, TDP 35W)
- Intel® Core™ i5-7500T 2.7GHz (up to 3.3 GHz, Quad Core, TDP 35W)
- Intel® Core™ i7-6700TE 2.4 GHz (up to 3.4GHz, quad-core, TDP 35W)
- Intel® Core™ i5-6500TE 2.3 GHz (up to 3.3GHz, quad-core, TDP 35W)
- Chipset
- Intel® Q170/C236 with Xeon® E3 only
- System Memory
- 2 x 260-pin DDR4 SO-DIMM,
- 8 GB pre-installed (for i5/i5KBL/i7 sku)
- 16 GB pre-installed (for i7KBL sku)
- 32 GB pre-installed (for E3 sku)
- Storage
- Hard Drive
- 2 x 2.5’’ SATA 6Gb/s HDD/SSD bay, RAID 0/1 support
- (1x 2.5” 1TB HDD pre-installed)
- I/O Interfaces
- USB 3.0
- 4
- USB 2.0
- 4
- Ethernet
- 2 x RJ-45
- LAN1: Intel® I219LM PCIe controller with Intel® vPro™ support
- LAN2 (iRIS): Intel® I210 PCIe controller
- COM Port
- 4 x RS-232 (2 x RJ-45, 2 x DB-9 w/2.5KV isolation protection)
- 2 x RS-232/422/485 (DB-9)
- Digital I/O
- 8-bit digital I/O, 4-bit input / 4-bit output
- Display
- 1 x VGA
- 1 x HDMI/DP
- 1 x iDP (optional)
- Resolution
- VGA: Up to 1920 x 1200@60Hz
- HDMI/DP: Up to 4096×2304@24Hz / 4096×2304@60Hz
- Audio
- 1 x Line-out, 1 x Mic-in
- TPM
- 1x Infineon TPM 2.0 Module
- Expansions
- Backplane
- 2 x PCIe x8
- PCIe Mini
- 1 x Half-size PCIe Mini slot
- 1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
- Power
- Power Input
- DC Jack: 9 V~36 V DC
- Terminal Block: 9 V~36 V DC
- Power Consumption
- 19 [email protected] A (Intel® Core™ i7-6700TE with 8 GB memory)
- Internal Power output
- 5V@3A or 12V@3A
- Reliability
- Mounting
- Wall mount
- Operating Temperature
- Xeon® E3 -20°C ~ 60°C with air flow (SSD), 10% ~ 95%, non-condensing
- i7-7700T -20°C ~ 35°C with air flow (SSD), 10% ~ 95%, non-condensing
- i5-7500T -20°C ~ 45°C with air flow (SSD), 10% ~ 95%, non-condensing
- i7-6700TE -20°C ~ 45°C with air flow (SSD), 10% ~ 95%, non-condensing
- i5-6500TE -20°C ~ 60°C with air flow (SSD), 10% ~ 95%, non-condensing
- Operating Vibration
- MIL-STD-810G 514.6 C-1 (with SSD)
- Safety/EMC
- CE/FCC/RoHS
- OS
- Supported OS
- Win10/Linux Ubuntu 16.04 LTS
Filter criteria
- Ready-to-Use
- yes
- Applications
- A.I. Artificial Intelligence
- Technologies
- Intel Kaby Lake
- Socket
- (with Processor)
- Processor
- Core i7
- Clock Speed
- 2.9GHz
- Fanless
- yes
- RAM Capacity
- 16 GB
- OS
- Linux
- Manufacturer
- IEI
- Status
- Phased out
- Customs Tariff Number
- 84715000
- WEEE Number
- DE76344510
Packing list
- 1x Chassis Screw
- 1x Mounting Bracket
- 1x QSG
- 1x 120W Adapter
- 1x Power Cord