TANK-871-Q170i-i3/4G-R10 (ATO)

Beschreibung

● 6th Gen Intel® Core™ processor platform with Intel® Q170 chipset and DDR4 memory
● Triple independent display with high resolution support
● Rich high-speed I/O interfaces on one side for easy installation
● IEI iRIS-2400 solution

Spezifikation

Chassis
Color: Black C + Silver
Dimensions (WxDxH) (mm): 82.2 x 255.2 x 204
System Fan: Fanless
Chassis Construction: Extruded aluminum alloy
Motherboard
CPU: Intel® Core™ i7-6700TE 2.4 GHz; Intel® Core™ i5-6500TE 2.3 GHz
Chipset: Intel® Q170
System Memory: 2 x 260-pin DDR4 SO-DIMM, pre-installed one 4GB (system max: 64GB)
IPMI: 1 x iRIS-2400 (optional)
Storage
Hard Drive: 2 x 2.5’’ SATA 6Gb/s HDD/SSD bay (RAID 0/1 support)
I/O Interfaces
USB 3.0: 4
USB 2.0: 4
Ethernet: 2 x RJ-45; LAN1 (iRIS): Intel® I210 PCIe controller; LAN2: Intel® I219LM PCIe controller
COM Port: 4 on rear I/O (2 isolation); 2 on rear I/O
Digital I/O: 8 bit Digital I/O, 4 bit input / 4 bit output
Display: 1 x VGA, 1 x HDMI+DP, 1 x IDP
Resolution: VGA: Up to 1920 x 1200@60Hz; HDMI: Up to 4096 x 2160@24Hz
Audio: 1 x Line-out ; 1 x Mic-in
Wireless: 1 x 802.11a/b/g/n/ac (optional)
Expansions
PCIe Mini: 1 x Half-size PCIe Mini slot; 1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
Power
Power Input: DC Jack: 9 V~36 V DC; Terminal Block: 9 V~36 V DC
Power Consumption: 19 [email protected] A (Intel® Core™ i7-6700TE with 8 GB memory)
Reliability
Mounting: Wall mount
Operating Temperature/Humidity: i7-6700TE: -20°C ~ 45°C with air flow (SSD),; 10% ~ 95%, non-condensing; i5-6500TE: -20°C ~ 60°C with air flow (SSD),; 10% ~ 95%, non-condensing
Storage Temperature/Humidity: -40°C ~85°C with air flow (SSD), 10% ~ 90%, non-condensing
Operating Shock: Half-sine wave shock 5G; 11ms; 100 shocks per axis
Operating Vibration: MIL-STD-810G 514.6 C-1 (with SSD)
Weight (Net/Gross): TBD
Safety/EMC: CE/FCC
OS
Supported OS: Microsoft® Windows® 8 Embedded, Microsoft® Windows® Embedded Standard 7 E