FRAGEN SIE UNS

Beschreibung

● 6th generation Intel® Core™ processor platform
● Rich high-speed I/O interfaces on one side for easy installation
● On-board internal power connector for providing power to add-on cards
● Great flexibility for hardware expansion

Spezifikation

Filterkriterien

Zollnummer
84715000
Ready-to-Use
ja
Applikationen
IoT/Industrie 4.0
Technologien
Intel Skylake
Sockel
(mit Prozessor)
Prozessor
Core I
Taktfrequenz
2.3GHz
Lüfterlos
ja
RAM Kapazität
8 GB
Status
Angekündigt
Hersteller
IEI

Spezifikation

Chassis
Color
Black C + Silver
Dimensions (WxDxH) (mm)
2-slot: 121.5 x 255.2 x 205
4-slot: 154.8 x 255.2 x 205
System Fan
Fanless
Chassis Construction
Extruded aluminum alloys
Motherboard
CPU
Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP=35)
Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35)
Chipset
Intel® Q170
System Memory
2 x 260-pin DDR4 SO-DIMM,
one 4 GB pre-installed (system max: 64GB)
IPMI
iRIS Solution
1 x iRIS-2400 (optional)
Storage
Hard Drive
2 x 2.5'' SATA 6Gb/s HDD/SSD bay (RAID 0/1/5/10 support)
I/O Interfaces
USB 3.0
4
USB 2.0
4
Ethernet
2 x RJ-45
LAN1: Intel® I219LM PCIe controller
LAN2 (iRIS): Intel® I210 PCIe controller
COM Port
4 x RS-232 (2 x RJ-45, 2 x DB-9 w/ isolation)
2 x RS-232/422/485 (DB-9)
Digital I/O
8-bit digital I/O , 4-bit input / 4-bit output
Display
1 x VGA
1 x HDMI+DP
1 x iDP (optional)
Resolution
VGA: Up to 1920 x 1200@60Hz
HDMI/DP: Up to 4096×2304@60Hz
Audio
1 x Line-out, 1 x Mic-in
Wireless
1 x 802.11b/g/n ( optional)
Expansions
Backplane
2-slot model: 1 x PCIe x16, 1 x PCI
2-slot model: 2 x PCIe x8
4-slot model: 2 x PCIe x8, 2 x PCI, 1 x Full-size PCIe Mni
4-slot model: 1 x PCIe x16, 3 x PCI, 1 x Full-size PCIe Mni
PCIe Mini
1 x Half-size PCIe Mini slot
1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
Power
Power Input
DC Jack: 9 V~36 V DC
Terminal Block: 9 V~36 V DC
Power Consumption
19 V@3.68 A (Intel® Core™ i7-6700TE with 8 GB memory)
Internal Power Connector
5V@3A or 12V@3A
Reliability
Mounting
Wall mount
Operating Temperature
i7-6700TE -20°C ~ 45°C with air flow (SSD), 10% ~ 95%, non-condensing
i5-6500TE -20°C ~ 60°C with air flow (SSD), 10% ~ 95%, non-condensing
Storage Temperature
-40°C ~85°C with air flow (SSD), 10% ~ 90%, non-condensing
Operating Shock
Half-sine wave shock 5G, 11ms, 100 shocks per axis
Operating Vibration
MIL-STD-810G 514.6 C-1 (with SSD)
Weight (Net/Gross)
2-slot: 4.2 kg/6.3 kg
4-slot: 4.5 kg/6.5 kg
Safety/EMC
CE/FCC
Supported OS
Microsoft® Windows® 8 Embedded, Microsoft® Windows® Embedded Standard 7 E

Packliste

  • 1 * Utility CD
  • 1 * Chassis Screw
  • 1 * One Key Recovery CD
  • 1 * Mounting Bracket

Zubehör

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