Thin-Mini ITX Board with Coffee-Lake Octa/Hexa-Core Processor Support

Neuigkeiten bei ICP Deutschland GmbH - Offizieller Partner von IEI
Thin-Mini ITX Board with Coffee-Lake Octa/Hexa-Core Processor Support

Thin-Mini ITX Board with Coffee-Lake Octa/Hexa-Core Processor Support


Main feature of the new Thin-Mini-ITX Board PH14FEI from ICP Germany is the support of Intel® 9th and 8th Core ITM processors. The PH14FEI board with 5-phase power design was designed to support processors with up to 95 watts or a maximum IA core current of 138 amps. Thus, the 8th generation Hexa-Core ITM with 95 Watt TDP or the 9th generation Octa-Core ITM with 35 Watt TDP can be operated on the board.

The PH14FEI is available in two versions, a low-cost version with Intel® H310 chipset and a fully-featured version with Q370 chipset. Two horizontally arranged SO-DIMM DDR4 memory banks allow both versions to be upgraded to a maximum of 32GB RAM in dual channel operation. The PH14FEI supports three displays simultaneously and offers one HDMI, two display ports, one LVDS or an embedded display port instead of LVDS. In addition, the PH14FEI offers four USB 3.1 Gen.2 with 10Gb/sec and five USB2.0 for the Q370 variant and four USB 3.0 and four USB2.0 for the H310 variant, two Intel GbE ports, two RS-232, two RS-232/422/485. In addition to eight programmable GPIOs, the MiAPI interface also offers the possibility of monitoring the boards. A PCI Express x16 slot, an M.2 2260/2280, an M.2 2230, a full-size Mini PCIe slot and a TPM pin header are available for expansion. The PH14FEI is designed for operation with 12 VDC and can be extended to 24 VDC via an optional DC-DC power board. All variants operate reliably in a temperature range from 0 °C to 60 °C.

Upon customer request, ICP can also supply the PH14FEI as a bundle with processor, industrial RAM and storage medium.


Specifications

  • ● §  Thin-Mini-ITX Form Factor
  • ● §  Intel® Coffee Lake 9th and 8th Gen. Core i9/i7/i5/i3 LGA Processors
  • ● §  Support for 95 Watt Core I CPU
  • ● §  Intel® H310/Q370 chipset
  • ● §  Max. 32GB DDR4 SO-DIMM RAM
  • ● §  Triple Display Support
  • ● §  1x M.2 2280, 1x M.2 2230, 1x mPCIe Full Size, 1x PCIe x16
  • ● §  Intel® GbE Ethernet, USB3.1, HDMI, DP, LVDS/eDP, RS-232/422/485


Applications

  • ● §  Panel PC and Ultra-flat Embedded Systems
  • ● §  Compact display systems
  • ● §  Industrial PC Systems
  • ● §  Image and video processing

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