Low-entry embedded board with Jasper Lake processor

Embedded board with Tripple 2.5G network interface

With the WAFER-JL, ICP-Germany is expanding its portfolio in the area of embedded boards.

The WAFER-JL is a 3.5" mainboard that is equipped with a cooling shell. The cooling shell enables a very simple installation of the board as well as an uncomplicated heat dissipation of the installed components, which is an advantage for vending machine manufacturers or machine builders.

The 3.5" embedded board is equipped with a Jasper Lake Celeron® N5105 processor, which has four processor cores and a maximum Turbo frequency of 2.9GHz. Up to 16Gb DDR4 RAM with 2933MHz clock frequency is supported. Furthermore, an HDMI port and a display port with a maximum resolution of 4096x2160 pixels are available. In addition to the two display ports, two USB3.2 Type A of the second generation with 10Gb/s and three RJ45 ports are found on the IO Shield. Three Intel i225V were used as network ICs, which each enable a speed of up to 2.5GbE. In addition, two RS-232, two USB2.0 and six digital inputs and outputs each are available internally. For expansion, one M.2 2230 with A-Key and one M.2 3042/2280 with B-Key slot are available. The board operates with 12 volts DC in a temperature range from 0 °C to 60 °C.

On request, ICP supplies the board with suitable industrial main memory and solid state memory.

Specifications

• ● 3.5" CPU board with heat spreader cooling concept
• ● Intel® 10nm Jasper Lake Celeron® processor
• ● Max. 16GB DDR4 SO-DIMM memory
• ● Two independent displays: HDMI and Display Port
• ● Tripple 2.5G network interface
• ● USB 3.2, SATA, COM
• ● Extensions: M.2 slots

Applications

• ● Machine builder
• ● Machine builders
• ● Display systems
• ● Ultra flat embedded systems
• ● Point of sale applications