3.5" embedded board with Elkhart Lake processor

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3.5" embedded board with Elkhart Lake processor

3.5" embedded board for IoT applications

With the WAFER-EHL ICP-Germany expands its portfolio in the area of embedded boards.

The WAFER-EHL is a 3.5" mainboard which has a cooling shell. This allows a very simple installation of the board as well as an uncomplicated heat dissipation of the installed components, which is an advantage for machine builders or mechanical engineers.

The WAFER-EHL 3.5" embedded board is equipped with an Elkhart Lake Celeron® J6412 processor, which has four processor cores. The Elkhart Lake generation is designed for IoT edge devices and brings features in IoT, real-time performance and functional security, among others. In addition, performance has been increased by up to 1.7X in single-thread performance and up to 1.5X in multi-thread performance compared to the previous generation. Thanks to Intel® Gaussian & Neural Accelerator (GNA), audio-based neural networks can be executed at low power consumption, reducing CPU workload. The burst frequency of the Celeron® CPU is 2.60GHz. An 8GB DDR4 RAM module with 3200 MHz is permanently installed on the WAFER-EHL 3.5" board as standard.

For graphics output, the board is equipped with a display port with maximum resolution of 4096x2160 pixels and an HDMI port. An eDP, LVDS or VGA module can be added via the IEI IDPM 3040 slot.

Particularly noteworthy is the PCIe x4 slot, which is a real special feature on the 3.5" board and makes expansion with riser cards possible. As network ICs, two Intel i225V were used, which allow a speed of up to 2.5GbE each. Internally the board has two RS-232/422/485, four USB2.0 interfaces as well as a 12bit digital input and output, externally two USB3.2 ports. For expansions, one M.2 2230 with A-Key and one M.2 3042/2280 with B-Key slot are available. The board operates with 12 volts DC in a temperature range from 0 °C to 60 °C.

On request, ICP supplies the board with suitable industrial main memory and solid state memory.


Specifications

  • ● 3.5" CPU board with heat spreader cooling concept
  • ● Intel® 10nm Elkhart Lake Celeron® processor
  • ● Max. 8GB DDR4 SO-DIMM memory
  • ● Expandable through PCIe x4 slot
  • ● Three independent displays: HDMI, Display Port and optional IDPM
  • ● Dual 2.5G network interface
  • ● USB 3.2, SATA, COM
  • ● Extensions: M.2 slots


Applications

  • ● IoT
  • ● Machine builder
  • ● Machine builder
  • ● Display systems
  • ● Ultra flat embedded systems
  • ● Point of sale applications