3,5” WAFER-TGL Embedded Board with Tiger Lake Processor

3.5" embedded board with Tripple 2.5G network interface

Four display connectivity options, three 2.5GbE network ports and Intel®'s 11th generation Core I processor technology on 3.5" size, enabled on the new WAFER-TGL from ICP Germany.

The 3.5" embedded board WAFER-TGL is available with four processor variants. The entry-level model is the WAFER-TGL-C, with Intel® CeleronTM 6305, two processor cores and two threads with a maximum of 1.8GHz. The mid-range model WAFER-TGL-I3, with an Intel® CoreTM I3-1115G4E, also two processor cores, four threads and a maximum clock frequency of 3.9GHz. Furthermore, the mid-high-end model WAFER-TGL-I5 with Intel® CoreTM I5-1145G7E, four processor cores and 8 threads and a maximum clock frequency of 4.1GHz. And last but not least, the high-end model WAFER-TGL-I7 with Intel® CoreTM I7-1185G7E, four processor cores and 8 threads and a maximum clock frequency of 4.4GHz.

Easy heat dissipation is enabled by the WAFER-TGL's cooling concept and the configurable Thermal Design Power (TDP) in the BIOS. The included cooling tray allows a very easy installation of the board to the case. In the BIOS, the TDP can be easily changed to make the system more power efficient or more performant. Up to 32GB DDR4 RAM with 3200MHz clock frequency is supported. In addition, the WAFER-TGL offers four independent display connectivity options. Two HDMI ports, one display port and one IDPM connector that can be expanded with an optional eDP, LVDS or VGA module. On the front, in addition to three display ports, there are four second-generation USB3.2 Type A with 10Gb/s and three RJ45 ports. Three Intel i225Vs were used as network ICs, each of which enables a speed of up to 2.5GbE. In addition, two RS-232/422/485, one RS-232, two USB2.0 and six digital inputs and outputs each are available internally. For expansion, one M.2 2230 with A-Key and one M.2 3042/2280 with B-Key slot are available. The board operates with 12 volts DC in a temperature range from 0 °C to 60 °C.

On request, ICP supplies the board with suitable industrial main memory and solid state memory.

Specifications

• ● 3.5" CPU board with heat spreader cooling concept
• ● 11th generation Intel® 10nm Tiger Lake UP3 processors
• ● Max. 32GB DDR4 SO-DIMM memory
• ● Quad independent displays: 2x HDMI, Display Port, IDPM
• ● Tripple 2.5G network interface
• ● USB, SATA, COM
• ● Extensions: M.2 slots

Applications

• ● Vending machine builders
• ● Machine builders
• ● Display systems
• ● Ultra flat embedded systems
• ● Point of sale applications
• ● Panel PC