3.5" embedded board with Whiskey Lake processors

Neuigkeiten bei ICP Deutschland GmbH - Offizieller Partner von IEI
3.5" embedded board with Whiskey Lake processors

More performance with mature Whiskey Lake processors


The WAFER-ULT5 is the second Whiskey Lake Embedded Board that ICP Germany is launching on the market.

The WAFER-ULT5 is a 3.5" mainboard which is equipped with a cooling tray. The cooling tray allows a very easy installation of the board and an uncomplicated heat dissipation of the installed components, which is an advantage for vending machine manufacturers or machine builders.

Like the recently introduced NANO-ULT5 Epic Board, the 3.5" embedded board is equipped with the Refresh processors of the 8th generation of Intel® Core-I processors. Intel continues to use the mature 14nm technology for this generation, but provides significant performance gains. The comparison with the previous Core-i7 version provides a doubling of the CPU cores, an almost 13% higher Turbo Bost clock speed, over 23% increase in the CPU Single Thread Rating with the same Thermal Design Power of 15 Watt. The WAFER-ULT5 board is offered with Celeron®, Intel Core i3, i5 and i7. Up to 32Gb DDR4 RAM is supported.

Furthermore two HDMI ports with a max. resolution of 4096x2160 and one LVDS port with a max. resolution of 1920x1200 are available. On the IO Shield there are four USB3.1 of the second generation and three RJ45 ports in addition to the two HDMI ports. Two Intel i211AT and one i219 were used as network ICs. In addition, one RS-232, one RS-232/422/485, one SATA and two USB2.0 interfaces as well as four digital inputs and outputs each are available internally. An M.2 2230 with A-Key and a full-size Mini-PCIe slot with mSATA support are available for expansion.

The board operates with 12 Volt DC voltage in a temperature range from -20 °C to 60 °C. On request, ICP can supply the board with suitable industrial memory and solid state memory.


Specifications

  • ● 3.5" CPU Board with Intel® 14nm 8th Gen. ULT processor
  • ● Max. 32GB Dual Channel DDR4 SO-DIMM Memory
  • ● Three independent displays: Dual HDMI and LVDS
  • ● USB 3.1 Gen 2, SATA 6Gb/s and Triple GbE LAN
  • ● Extensions: mPCIe and M.2 slot
  • ● Heat Spreader or Heatsink (optional) Cooling concept


Applications

  • ● Vending machine manufacturer
  • ● Mechanical engineers
  • ● Panel PC and display
  • ● Ultra-flat embedded systems
  • ● Display systems

All Industrial Computer News